Carbon Ink
        Copper Conductive Paste
        Copper Conductive Paste
        Copper Conductive Paste

        Copper Conductive Paste

        $109.00
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        Quantity :

        Main Features

        • Volume resistivity: Less than 1 × 10⁻⁴ Ω·cm
        • Thermal conductivity: 401 W·m⁻¹·K⁻¹
        • Curing requirements: 150 °C for 30–60 minutes
        • Viscosity: 18 ± 2 Pa·s
        • Solid fraction: Above 80%
        • Physical form: Brown-colored paste
        • Usable storage period: 3 months
        • Recommended storage range: 0 °C to 10 °C
        • Melting point: 1085 °C
        • Boiling point: 2562 °C
        • Density: 8.96 g/cm³
        • Specific heat capacity: 0.39 kJ/kg·K

        Details and Specifications of Copper Conductive Paste

        Copper Conductive Paste works as both a bonding agent and an electrical conductor in electronic parts. It is made by blending fine copper powder with a binder and a suitable solvent to create a paste that can be printed or dispensed easily. Specific variants contain a small proportion of zinc borosilicate and glass frit, generally 0.5–8 percent by weight, to enhance adhesion and mechanical strength after curing. Depending on design and production requirements, the paste is applied using screen printing, stencil coating, or precision dispensing. It is dried or cured by air exposure, regulated heating, or ultraviolet radiation. Once curing is complete, the paste forms a continuous copper layer, ensuring stable, reliable electrical connections.

        Copper Conductive Paste is widely used in printed circuit boards, hybrid circuits, touch panels, and the fabrication of RFID antennas. It is also effective for repairing broken or damaged PCB tracks and for forming conductive paths on non-conductive substrates. The copper particles carry the electrical current, while the binder helps the paste stick firmly to the surface. The solvent adjusts the paste thickness and supports uniform layer formation during application. Many Copper Conductive Pastes cure at low temperatures, which aligns well with modern electronics manufacturing. They deliver reliable electrical performance and consistent results under different conditions.

        Copper Conductive Paste
        Copper Conductive Paste – Technical Specifications
        Product NameCopper Conductive Paste
        CompositionCopper particles dispersed in polymer binder
        AppearanceBrown / Copper-colored smooth paste
        Electrical ConductivityHigh conductivity (low resistivity)
        ResistivityTypically low (depends on formulation)
        ViscosityHigh viscosity paste (screen printable / dispensable)
        Particle SizeMicro / nano copper particles
        Curing MethodHeat cure / air cure (depending on grade)
        Curing TemperatureTypically 100°C – 180°C
        AdhesionStrong adhesion to glass, plastic, metal, and ceramics
        Thermal ConductivityModerate to high
        Application MethodsScreen printing, brushing, dispensing, spraying
        Substrate CompatibilityGlass, PET, PCB, ceramics, metals
        ApplicationsPrinted electronics, PCB repair, EMI shielding, conductive tracks
        Storage ConditionsCool, dry place (preferably 5°C – 15°C)
        Shelf LifeTypically 6 months (sealed container)
        PackagingSyringe / bottle (various sizes available)
        Country of OriginIndia
        Copper Paste

        Features of Copper Conductive Paste

        • Provides stable and reliable electrical conductivity in electronic components.
        • Maintains good electrical contact even under vibration or minor mechanical movement.
        • Enhances conductivity on uneven, worn, or lightly oxidized surfaces.
        • Allows electricity to flow smoothly and evenly.
        • Helps spread heat, reducing hot spots and heat damage.
        • Creates a strong conductive layer that stays stable during normal use.
        • Resists moisture and corrosion, which helps it last longer.
        • The binder helps it stick well to different surfaces.
        • Works well on glass, ceramics, and some plastics.
        • Can be applied by screen printing, stencils, or syringe use.
        • Fits well into automated and machine-based production.
        • Many types harden at low temperatures.
        • Can be used to repair broken conductive tracks on circuit boards.
        • Helps improve contact performance in electrical switches and connectors.
        • Retains application performance and conductivity after proper storage.

        Applications of ITO Coated Pen Sheet

        Copper conductive ink is widely used in PCB manufacturing because it forms the electrical paths that allow circuits to operate. It can be applied to plastic surfaces for flexible electronics and touch-based systems. The ink is also used in solar cells, RFID tags, MEMS components, LED packaging, and repair work. It supports EMI and RFI shielding and is suitable for ground connections, rotary switches, and potentiometers. In addition, it helps create conductive patterns, improves touch response, supports wireless signals, restores damaged circuits, protects electronic devices, and enhances conductivity in many electronic components. Electronic packaging, PCB repair and rework, Solar cell interconnections, RF component assembly, Flexible printed circuits (FPC), and other high-precision electronic manufacturing processes.

        Copper Liquid

        Copper vs Silver vs Nickel Conductive Paste

        PropertyCopper Conductive PasteSilver Conductive PasteNickel Conductive Paste
        Electrical ConductivityHighVery High (Best)Moderate
        ResistivityLowVery LowMedium
        CostLowVery HighModerate
        Oxidation ResistanceLow (oxidizes easily)ExcellentGood
        Thermal ConductivityHighVery HighModerate
        Adhesion StrengthGoodExcellentGood
        Curing Temperature100°C – 180°C80°C – 150°C120°C – 200°C
        DurabilityModerateExcellentHigh
        Corrosion ResistanceLowExcellentGood
        Best Use CasesCost-effective circuits, PCB repairHigh-performance electronics, precision circuitsEMI shielding, grounding applications
        Common ApplicationsPrinted electronics, DIY circuitsSensors, solar cells, high-end PCBShielding coatings, industrial electronics

        Safety Guidelines

        • Comply with the instructions listed in Material Safety Data Sheets (MSDS).
        • Use hand gloves, safety glasses, and a laboratory coat for protection.
        • Ensure proper ventilation in the work area.
        • Avoid ingestion, inhalation, and direct skin contact.
        • Store in a dry and adequately ventilated place.
        • Dispose of all materials according to local rules and approved disposal methods.
        • Stay prepared for emergencies by keeping spill response kits easy to reach.

        How to use Copper Conductive Paste

        • Make sure the surface is clean and completely dry before starting.
        • Apply the paste only to the required areas using screen printing or a syringe.
        • Spread the material evenly to achieve the right layer thickness.
        • Let the paste dry or cure as stated by the manufacturer.
        • After curing, check that it is firmly attached and conducts properly.
        • Discard leftover paste and waste materials in a safe and proper manner.

        Why Choose us?

        With more than ten years in the industry, Shilpent has built a strong presence as a trusted global supplier and manufacturer of Copper Conductive Paste. We focus on producing high-performance copper pastes and inks used across diverse applications. Quality is never an afterthought for us—it is checked at every stage, and our price remains fair and transparent. We collaborate with customers to understand their exact requirements and deliver solutions that fit their timelines and scale. Customer satisfaction guides every decision we make. Bulk orders are customized with care and shipped on schedule to avoid delays.

        Reach out to us today for reliable products, attractive pricing, and prompt delivery on both retail and wholesale orders.

        SE-CCP-NC-1000

        Specific References